New Standard 61439-2DC
GR now have their own temperature rise test facility which is capable of testing up to 7000A systems. The test rig installed in June 2006 at the Factory at Sherburn-in-Elmet is designed to accept a wide arrangement of configurations, and give a clear, Dynamic Test Results and Report of the Switchboard under test. The temperature rise data is linked to on-line automated temperature sensors system, which can be viewed locally and remotely from a PC.
- We have the Capability of testing the actual board which is shipped to site rather than relying on calculations from isolated tests.
- Functional tests of 100% rated systems in high integrity and onerous environments.
- Confirming the capacity of systems, where there is a requirement for proof of rating to a specific temperature rise figure, whereas before relying on extrapolated values would have been the case.
- The test centre allows a secure design base to facilitate a continuous improvement philosophy, and path, while operating in a diverse and changing environment.
What is Temperature Rise?Temperature Rise is an aspect of Type Testing Assemblies which is designed to verify Temperatures within and around a switchboard, and make sure they do not exceed specified limits, relative to the ambient temperature. This is Known as temperature above ambient or "K". I.e. 70K = 70°C above the ambient air16°C. Therefore 16°C + 70°C = 86°C.
How does it affect assemblies?With the pursuit of more compact assemblies, optimisation of component sizes, and conservation of raw materials, the potential for higher temperatures within assemblies by manufacturers oblivious to temperature rise, the probability of failures are increasing. Quality Manufacturers of Switchgear appreciate and manage this complex issue, by testing and extrapolating temperature rise data. GR is one of the very few, who actually have an on site test station to confirm the performance and integrity where required.
What is TTA and PTA?There are only subtle differences between the two, with both having the flexibility if extrapolation calculations, based from an original test with that device
Designed CapacityThe Current caring capacity of a BusBar is usually determined by the maximum temperature at which the Bar is permitted to operate (table 2 EN 60439-1)
How does it affect assemblies
- I2R Losses, require to be dissipated, by either Convection, Radiation or Conduction.
- Devices Connected to the Bus Bar system also Conduct heat into the Busbar System